Baum’s products were conceived to solve real world power issues in today’s demanding designs. They fill a large gap in the solution space by providing breakthrough speed and accuracy never seen before in combination. Now, with Baum’s innovative products, designers and architects can analyze and optimize power and thermal dissipation on their chip designs using real world workloads. These capabilities provide users with confidence that their designs will meet the power and thermal budgets prior to tape-out. Our customers have used Baum’s products to lower both the average, transient, and peak power consumption in their designs. Baum’s products expose power issues and guide users to their solutions.
PowerBaum is our flagship product which takes design sources (RTL and netlist) and automatically creates an extremely fast, accurate, and portable power model. PowerBaum models easily integrate into existing simulation (both RTL and ESL), and emulation environments.
PowerWurzel is Baum’s gate-level simulation engine used to train PowerBaum power models. Combining PowerWurzel with PowerBaum creates a powerful and efficient flow to generate extremely fast and accurate power models.
“Having a solution that achieves both the speed necessary to run a variety of realistic scenarios, combined with providing a very high level of accuracy, allowed us to uncover power problems quickly and identify where to make the fixes. Without Baum’s unique power analysis capabilities, we wouldn’t have been able to find and fix these issues causing our new product to consume too much power,” remarks Moon-Soo Kim, vice president of engineering at Telechips.